Chip-On-Flex or COF is a semiconductor assembly technology in which the die is mounted directly on the flexible substrate circuit board as against the traditional printed circuit boards, along with electrical connections. Chip-On-Flex offers multiple advantages over the printed circuit boards such as reduced weight, compact size, high reliability and lower production cost. Flexible reinforced boards, semi-flexible…
Chip-On-Flex (COF) Market: Competitive Strategies, Regional Analysis Forecast 2026
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